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Shaft integrated type/sponge independent type PVA sponge
Applications:
Ultra-high purity PVA used in semiconductor precision cleaning projects.
Superior mold design capability to produce core-integrated products.
Eliminates the root cause of Alignment or Gap occurrence.
A core body designed to evenly spread the chemical over the entire brush.
Prevents fine scratches on the wafer surface with superior technical capabilities.
Realizes reduction of Aging time.
- Description
Product Characteristics
Semiconductor
A special material that allows precision cleaning by face-to-face contact for 3D memory chips and single-digit nanometer microprocessors.
HDD
It is necessary to remove contaminants from face-to-face contact for the advantages of ultra-high speed and ultra-capacity data storage.
Thin Film/ Optics/ LED
Used for micro-contaminant removal before and after ultra-thin film plating.
MEMs/ Solar
Used for contaminant reduction in the manufacturing of wearable devices or implants.
APPLICATIONS
Semiconductor manufacturing
post-CMP
FEoL, MoL, BEoL
Substrate
Prime SI, SOI, Reclaim
Photomasking cleaning
Chamber cleaning
HDD
HDDDisk
AL glass, NiP, PZT
Read/Write Head
Thi-film, MR
Thin Film / Optics / LED
Nano coatings
Smart Glass
Optical Communications
Instrumentation
MEMs / Solar
Inertial Sensors
Micro fluidics
RF Solar TF/Silicone cleaning, drying
drying
application equipment
Applied Equipment: Mirra Mesa 200, Reflexion LK300, Solar Inertial Sensors
Applied Materials: Mirra Mesa 200, Reflexion LK300,
Reflexion LK Prime 300 etc.
Ebara: EPO XXX, F-Rex200, F-Res 300S ( I/II)
Lam Research: Ontract Series I/II, Synergy Integra
Can be customized according to customer's needs